【Special Price】BGA Reballing Stencil for Pixel Repair QU-7

✨【Limited-Time Special Price】BGA Reballing Stencil + Solder Balls for Google Pixel Repair (Unused) Set✨
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This is a set of BGA reballing stencils (metal masks) and solder balls (new, unused) for smartphone and motherboard repairs.
Please use this for rework tasks on Google Pixel devices (around the SoC for Snapdragon-equipped models), etc.

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Set Contents (Everything shown in the photos)
• BGA Reballing Stencil (Used): Marked QU:7／Qualcomm CPU 0.12mm
Compatible SoC markings included (examples):
• SM4250 (Snapdragon 460)
• SM6115 (Snapdragon 662)
• SM6115 (Snapdragon 665)
• SM7125 (Snapdragon 720G)
• SM7150 (Snapdragon 730G)
• SM7225 (Snapdragon 750G)
• SM7250 (Snapdragon 765G)
• SM7350 (Snapdragon 775G)
*Please check the photos for the markings.
• Solder Balls x 2 (New, Unused)
• Marking: Sn63/Pb37 (Leaded) / 505 SOLDER BALL / 25000PCS
*Please check the label for the ball size range (see photos).

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Recommended Uses
• BGA reballing (re-balling) for Snapdragon-equipped smartphones, including Google Pixel devices.
• Practice for SoC/IC reattachment, rework, and motherboard repair.

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Please Read Before Purchasing (Important)
• This product is for specialized use (repair/rework). Technical knowledge and equipment are required.
• Compatibility (SoC model number, pitch, ball size) must be confirmed by the purchaser.
• As the stencil is used, there may be scuffs or dirt (photos take precedence).
• To prevent fraud, returns are generally not accepted.
However, please contact us before rating if there is an initial defect or if the item significantly differs from the description.

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If you have any questions (regarding ball size, compatible SoC confirmation, etc.), please feel free to comment.
Thank you very much.